TSMC predicts that the global chip market will reach $1.5 trillion by 2030 because of AI


The current AI boom is causing scarcity for some and massive profits for others. Reuters reports that in a presentation earlier today, TSMC predicted that the global semiconductor market will reach $1.5+ trillion by 2030 – for context, the previous forecast was for $1.0 trillion.

And it’s clear that demand for AI silicon is driving the massive increase in sales – according to TSMC’s breakdown, 55% of that $1.5 trillion market will come from AI (and other high-performance computing), while smartphones account for only 20% and cars for only 10%.

We won’t even have to wait until 2030 to see the changes in the market – the company forecasts that demand for AI accelerator wafers this year will increase 11x compared to 2022. That’s only four years of calendar time, yet AI went from a curiosity to something every business executive talks about.

Naturally, the company is making hay while the sun shines – it is building out new production facilities faster than before. And not just in Taiwan, either.

TSMC has a plant in Arizona and got a $6.6 billion grant from the US a couple of years ago. That first plant is already producing chips – not the cutting edge silicon (TSMC keeps that in Taiwan), but it is making 4nm chips and will move to 3nm and 2nm in time.

TSMC’s fab in Arizona
TSMC’s fab in Arizona

There’s a second fab that’s almost complete – TSMC will bring in the expensive and delicate machines that make the chips later this year. A third fab is under construction with a fourth coming soon, plus an advanced packaging facility. The company is even looking to buy more land for future expansions. According to TSMC, the Arizona fab will see a 1.8x year-on-year increase in production this year with yields similar to what fabs in Taiwan are seeing.

TSMC also has a fab in Japan – it makes older 22nm and 28nm chips. These aren’t suitable for high-performance compute parts, of course, but these nodes are popular for automotive parts and various low-power components. The company plans to start 3nm production in a second Japanese fab.

There’s also a plant being built in Germany – this will also start with 22nm and 28nm parts (which will make German car companies happy) with plans to add 16nm and 12nm capabilities later.

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