Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup.
The chip in question is said to be the first mobile chip for the company built on the LogicFolding architecture, and will be able to compete with 3nm chips. Interestingly, the spokesperson didn’t exactly say that the next Kirin chip will be 3nm, but instead said it will be on the same level as modern 3nm chips.
The innovative architecture allowed the company to increase the transistor density by 53.5%, which improves performance by 41% and increases the peak frequency by 12.7%. This will also improve energy efficiency.
However, the name of the next-generation Kirin chipset remains undisclosed and we will likely get the tidbits once the Huawei Mate 90 series launch is near, which will be this fall.